Computer hardware engineers
Also called ASIC engineer, ASIC design engineer, Chip design engineer, VLSI engineer, VLSI design engineer
In brief
In May 2025, BLS counted 76,660 US computer hardware engineers, with median pay of $161,740 a year. Of the BLS counts since 2003, the highest was 82,660, in May 2023. The last full technology era for computer hardware engineers: Custom AI accelerator silicon, 2015 to 2022. The custom silicon boom at hyperscalers was a major driver of the employment recovery from the 2014 trough.
What the sources say
Official outlook
BLS projects employment to grow 9.1% from 2025 to 2035.
AI exposure studies
- 31.8% of this job's tasks are exposed to large language models. Not a forecast of job losses. Eloundou and others, 2023
- 0.22 estimated probability that the whole occupation could be computerised, over an unspecified number of years. Not a forecast of job losses. Frey and Osborne, 2013
Since the 2013 prediction
In 2013, Frey and Osborne put this job's probability of computerisation at 0.22. BLS counted 77,670 of these jobs in May 2013 and 76,660 in May 2025 (-1%, a change derived by Future History).
Data as of BLS OEWS May 2025; BLS Employment Projections 2025-35. BLS publishes these counts as yearly survey snapshots and cautions against reading them as a precise trend. In May 2021 BLS changed how it estimates these counts (a model-based method using three years of survey data) and moved fully to the 2018 occupation codes, so part of a change across 2021 can come from the method rather than the work.
Last updated .
Cite this page
Future History. (2026, October 11). Computer hardware engineers: jobs and pay since 1999 [Data set; data as of BLS OEWS May 2025; BLS Employment Projections 2025-35]. https://futurehistory.earth/timeline/17-2061
Future History. "Computer hardware engineers: jobs and pay since 1999." Data as of BLS OEWS May 2025; BLS Employment Projections 2025-35. Last modified October 11, 2026. https://futurehistory.earth/timeline/17-2061.
@misc{futurehistory_17_2061, author = {{Future History}}, title = {Computer hardware engineers: jobs and pay since 1999}, year = {2026}, month = oct, howpublished = {\url{https://futurehistory.earth/timeline/17-2061}}, note = {Last updated 2026-10-11. Data as of BLS OEWS May 2025; BLS Employment Projections 2025-35}, }
The access date is today's date on your device.
≈ $157,593 in 2024 prices (derived by us, CPI-adjusted)
February 14, 1946: ENIAC is unveiled at the Moore School of Electrical Engineering, University of Pennsylvania. J. Presper Eckert and John Mauchly built it with a team of six women programmers (Kay McNulty, Betty Jennings, Fran Bilas, Marlyn Wescoff, Ruth Lichterman, Betty Snyder) who wired its physical patch panels. ENIAC weighed 30 tons, occupied 1,800 square feet, and consumed 150 kilowatts. It could perform 5,000 additions per second, roughly 1,000 times faster than existing electromechanical calculators. The engineers who built it had to invent their own methods for every aspect of the work: no textbooks, no design rules, no simulation. They are the founding generation of the occupation.
Jack Kilby at Texas Instruments demonstrates the first working integrated circuit on July 24, 1958, using germanium. Robert Noyce at Fairchild Semiconductor independently and concurrently develops a silicon-based IC. Kilby receives the Nobel Prize in Physics in 2000 for the invention. The IC makes mass-production of complex logic possible for the first time: a single chip replaces a circuit board full of discrete transistors, enabling smaller, cheaper, and more reliable digital systems. Hardware engineers shift from transistor-level design to gate-level composition over the following decade.
November 15, 1971: Intel places a full-page advertisement in Electronic News announcing the MCS-4 chip set, anchored by the 4004 microprocessor. Federico Faggin, Ted Hoff, Stan Mazor, and Masatoshi Shima designed the 4004 in nine months, integrating 2,300 transistors onto a 4-bit chip at 740 kHz. The 4004 delivered as much processing power as ENIAC, which filled an entire room, in a chip smaller than a fingernail. Intel noted it took five years to educate the engineering community about how to build products using the microprocessor, which marks the emergence of a new specialization within hardware engineering: the microprocessor architect and the systems engineer who designed around a programmable processor.
Apple's Lisa (1983) and Macintosh (1984) demonstrate that a custom VLSI chip team working inside a consumer electronics company can deliver competitive silicon: the 16-bit 68000 CPU and Apple's custom chip set (IWM disk controller, VIA I/O chip) gave the Mac its character. The hardware engineering team for the original Macintosh was five people. The Mac's success accelerated a model where consumer electronics companies hired small internal hardware teams to design custom ASICs that gave their products differentiated features, seeding a new generation of "systems on a chip" engineers who thought about hardware and software together.
The dot-com bust (2000-2002) and the September 11, 2001 economic shock together hit the semiconductor industry severely. Venture funding for internet hardware startups evaporated; enterprise IT spending collapsed; DRAM and SRAM prices crashed. The US domestic semiconductor manufacturing workforce fell 43% from its 2000 peak employment levels. Computer hardware engineers had been counted together with software engineers in older BLS "computer engineers" figures; the SOC 2000 code 17-2061 counts them on their own from the OES 1999 national file onward, just before the bust hit.
Google publishes the details of its first Tensor Processing Unit (TPU) at the International Symposium on Computer Architecture (ISCA 2017). The paper reveals that Google had been running TPU v1 in its data centers since 2015 for TensorFlow inference. The TPU was a domain-specific accelerator: a 65,536-element matrix multiplication unit (the "systolic array") that was 15x to 30x faster and 30x to 80x more energy-efficient than contemporary CPUs and GPUs for inference workloads. The publication was a signal to the industry: the era of off-the-shelf chips as the universal compute substrate for AI had ended, and hyperscalers would compete on custom silicon. Every major cloud provider accelerated its custom chip program within two years.
August 9, 2022: President Biden signs the CHIPS and Science Act, allocating $52.7 billion for domestic semiconductor manufacturing and research, including $39 billion for fab incentives and $13.2 billion for semiconductor R&D and workforce development. Within 18 months, TSMC, Intel, Samsung, and Micron had announced or broken ground on a combined $400 billion-plus in US fab investment. For hardware engineers, the CHIPS Act created the largest domestic demand signal for the occupation since the PC era: each new fab requires hundreds of process engineers and hundreds more chip design engineers to fill it with products. The SIA projected in 2024 that 67,000 additional semiconductor workers would be needed by 2030, with the supply pipeline running years behind demand.
Will AI replace computer hardware engineers? What the research says
Each figure is stated by the named source; we publish no forecasts of our own. Where sources disagree, we show the disagreement rather than an average.
Each figure is stated by the named source; we publish no forecasts of our own. Where sources disagree, the spread is the honest signal.
What's changing day to day for computer hardware engineers
Three parts of your work where AI is already doing real lifting, and what stays yours.
AI is sitting alongside you hereRun autonomous chip implementation flows (place-and-route, clock tree synthesis, power network construction, and timing closure) using Cadence Cerebrus AI Studio or Synopsys DSO.ai: specify power, performance, and area (PPA) targets and process technology node
Run autonomous chip implementation flows (place-and-route, clock tree synthesis, power network construction, and timing closure) using Cadence Cerebrus AI Studio or Synopsys DSO.ai: specify power, performance, and area (PPA) targets and process technology node; let the reinforcement-learning engine explore billions of implementation recipes across the RTL-to-GDSII flow; review AI-generated implementation results against PDK DRC sign-off requirements, static timing analysis (STA) corner coverage, and power budgets before releasing to tape-out.[6],[12]
Cerebrus and DSO.ai explore far more of the implementation design space than a manual flow, but PPA targets that actually matter (the trade-off between performance and power at your specific voltage/frequency operating point, the die-area budget driven by packaging cost) require engineering judgment to set correctly. Learn to read STA exception reports critically: a timing path that AI "closed" with a false-path exception that your constraints file got wrong will produce silicon that fails at customer voltage and temperature corners, not just in simulation.
AI is sitting alongside you hereWrite and review RTL (Register-Transfer Level) code in SystemVerilog or VHDL for digital hardware blocks (arithmetic units, FIFOs, memory controllers, bus interfaces, and state machines) using GitHub Copilot with SystemVerilog context and NVIDIA ChipNeMo to generate boilerplate logic, testbench stubs, and EDA tool scripts from natural-language descriptions
Write and review RTL (Register-Transfer Level) code in SystemVerilog or VHDL for digital hardware blocks (arithmetic units, FIFOs, memory controllers, bus interfaces, and state machines) using GitHub Copilot with SystemVerilog context and NVIDIA ChipNeMo to generate boilerplate logic, testbench stubs, and EDA tool scripts from natural-language descriptions; review AI-generated HDL for functional correctness, timing closure readiness, and synthesis-friendliness before committing to the design database.[5],[11]
GitHub Copilot generates syntactically valid SystemVerilog quickly but has no model of your target PDK, timing constraints, or the multi-clock domain interactions across the SoC. ChipNeMo EDA script generation is trained on NVIDIA-internal corpora and degrades outside that distribution. Build a block-level lint and static-timing pre-check (SpyGlass, Cadence Conformal) as a mandatory gate before any AI-generated HDL reaches synthesis, catching latches, combinatorial loops, and CDCs early prevents expensive rework late in the tape-out flow.
AI is sitting alongside you herePerform functional verification of digital hardware designs using simulation (VCS, Questa), formal methods (Cadence JasperGold, Synopsys VC Formal), and AI-assisted coverage closure: use AI-powered verification tools to automatically generate directed stimulus, close coverage holes identified by the ML-driven coverage gap analyzer, and synthesize formal proofs for safety-critical hardware properties (FIFO overflow, arbitration liveness, bus error response)
Perform functional verification of digital hardware designs using simulation (VCS, Questa), formal methods (Cadence JasperGold, Synopsys VC Formal), and AI-assisted coverage closure: use AI-powered verification tools to automatically generate directed stimulus, close coverage holes identified by the ML-driven coverage gap analyzer, and synthesize formal proofs for safety-critical hardware properties (FIFO overflow, arbitration liveness, bus error response); triage AI-flagged coverage holes against the design specification to determine whether uncovered behavior represents a real bug, an unreachable state, or a missing constraint.[13],[9]
AI verification tools dramatically accelerate stimulus generation and coverage closure but are bounded by the quality of the testplan they are given. Formal tools prove properties relative to the assumptions you write, if your assumptions over-constrain the environment, the proof is vacuously true. Build rigorous property-writing skills (SVA / PSL), maintain a block-level verification plan with explicit coverage goals for every architectural corner case, and always run formal bounded model checking in parallel with simulation to catch bugs in under-stimulated deep-state spaces.
Where computer hardware engineers go next
Natural next steps for someone with your foundation: not exits, evolutions.
- Computer and Information Systems Managers
- US median pay
- $175,140 (May 2025)
- BLS outlook 2025-35
- +15.8%
- Architectural and Engineering Managers
- US median pay
- $171,270 (May 2025)
- BLS outlook 2025-35
- +5.5%
- Computer Systems Engineers/ArchitectsNo timeline for this role yet
What each move takes
Computer and Information Systems Managers
Hardware engineers who have built strong hardware/software co-design experience (defining HW/SW interfaces, working with OS and firmware teams, validating system-level software on silicon) are well-positioned to move into Computer and Information Systems Manager roles at technology companies where deep hardware literacy is a genuine differentiator. These roles oversee infrastructure, data center, or platform engineering teams and are increasingly valued for their ability to evaluate custom silicon programs (AI accelerator chips, DPUs, SmartNICs) and make build-vs-buy decisions for hardware infrastructure. BLS projects 15% growth for Computer and Information Systems Managers through 2034, much faster than average, driven by AI infrastructure investment.
- · IT infrastructure management: data center operations, server and network procurement cycles, cloud vs. on-premises economics for AI training and inference workloads
- · Technology strategy: vendor evaluation frameworks for AI accelerator hardware, ROI modeling for custom silicon vs. commodity GPU, technology roadmap planning
- · IT governance and security: information security frameworks (SOC 2, ISO 27001), hardware supply chain risk management, semiconductor export control compliance
- · Budget management: capital expenditure planning for hardware infrastructure, depreciation modeling, cloud cost optimization at scale
- · Team leadership: managing software, systems, and infrastructure engineers; building cross-functional relationships with hardware design, procurement, and finance
How has the work of computer hardware engineers changed since 1946?
The tools that defined the work, one line per era. Select an era to see how it reshaped the work.
Pencil, oscilloscope, and physical breadboard (vacuum-tube era)
The first generation of computer hardware engineers had no CAD tools, no simulation software, and no formal HDL. Design was done on paper: drawing switching circuits with Boolean algebra, tracing timing diagrams by hand, and wiring physical breadboards of vacuum tubes or, from the mid-1950s, discrete transistors. The oscilloscope was the primary debugging instrument. Verification meant powering the circuit up and measuring whether it behaved as the schematic predicted. Every design was physically unique and entirely dependent on the engineer's ability to hold the entire circuit in memory.
Integrated circuit (IC) and manual schematic capture (SSI/MSI era)
Jack Kilby at Texas Instruments demonstrated the first integrated circuit in 1958; the commercial IC era launched in the early 1960s with small-scale integration (SSI, tens of transistors per chip) and grew into medium-scale integration (MSI, hundreds) by the late 1960s. For hardware engineers, integrated circuits introduced the component library concept: instead of designing logic from individual transistors, an engineer composed designs from standard gates (7400-series TTL, then CMOS 4000-series). Schematic capture remained manual, but the vocabulary shifted from transistor physics to logic gates and flip-flops. Timing and fan-out calculations were still done by hand. Debugging moved to the logic analyzer, which Hewlett-Packard introduced in 1973.
Effect on the workThe IC era roughly doubled what a single engineer could design in a project cycle, because gate-level design is faster than transistor-level design. It also expanded the market for digital hardware dramatically: previously only government labs and large corporations could afford digital computers; IC-era minicomputers from DEC and Data General brought digital hardware to universities and research labs throughout the 1960s.
Microprocessor and VLSI design (Intel 4004, 1971; MOSIS design service, 1981)
Intel unveiled the 4004, the first single-chip microprocessor, in November 1971. Designed by Federico Faggin, Ted Hoff, and Stan Mazor, it integrated 2,300 transistors on a 4-bit processor in a 16-pin package. By the late 1970s, very-large-scale integration (VLSI) was pushing chip transistor counts to tens of thousands and the complexity of manually tracing timing diagrams across that many gates was becoming impossible. The MOSIS (Metal Oxide Semiconductor Implementation Service) design service, launched in 1981, allowed engineers to submit designs for fabrication without owning a fab. This democratized custom chip design: for the first time, a university or startup could design an ASIC. The term "VLSI design engineer" entered common use.
Effect on the workThe microprocessor era bifurcated the hardware engineering field into two streams that persist today: architects who defined the instruction set, pipeline, and memory hierarchy of general-purpose processors, and implementation engineers who translated that architecture into silicon. It also created the fabless model, allowing chip design companies to exist without manufacturing capability, which ultimately grew the market for hardware engineers while distributing them across many smaller companies.
Commercial EDA tools: Synopsys logic synthesis (1986) and Cadence layout (1988)
Synopsys was founded in 1986 and introduced logic synthesis, which automated the translation of hardware description languages (first VHDL, then Verilog) into gate-level netlists. Cadence Design Systems was founded in 1988 and dominated physical design (place-and-route, layout). Together they defined the RTL-to-GDSII design flow that the field still uses today. The EDA era transformed hardware engineering: instead of drawing schematics by hand, engineers wrote RTL code that a synthesis tool compiled into gates. The engineer's primary artifact shifted from a schematic to a text file, bringing hardware design closer in workflow to software development while retaining the physical constraints of real silicon. Simulation (Verilog-XL, then VCS, Questa) replaced breadboard testing as the primary verification method.
Effect on the workEDA tools dramatically raised design complexity per engineer, enabling teams of dozens to build chips with hundreds of millions of transistors. The commercial EDA era created the conditions for the fabless boom of the 1990s: Qualcomm, Broadcom, Marvell, and dozens of other fabless semiconductor companies relied on EDA tools and TSMC/GlobalFoundries for manufacturing, concentrating design talent in the United States while manufacturing shifted to Asia.
SystemVerilog, formal verification, and hardware IP licensing (UVM era)
As chip transistor counts crossed one billion (Intel's Itanium 2, 2003: 592 million; Intel's Xeon Nehalem, 2008: over 2 billion), manual simulation became inadequate for achieving functional coverage. The Universal Verification Methodology (UVM), standardized by Accellera in 2011, provided a constrained-random simulation framework that let verification engineers generate billions of test vectors automatically. SystemVerilog, which merged Verilog with design-by-contract constructs (assertions, coverage bins, and interfaces), became an IEEE standard in 2005 and the dominant design language for ASIC work. Formal verification tools (Cadence JasperGold, Synopsys VC Formal) enabled mathematical proof of hardware properties. For engineers, the UVM era created distinct specialization: RTL design engineers, functional verification engineers (DV engineers), physical design engineers, and post-silicon validation engineers became different career tracks within a single chip project.
Effect on the workThe UVM era raised the verification-to-design ratio sharply: by the mid-2000s, verification engineers outnumbered RTL design engineers on large projects by 2-to-1 or more. This inflated the total chip-development headcount per project and was the primary reason hardware team sizes grew through the 2000s even as individual engineer productivity on the design side rose with better EDA tools.
Custom AI accelerator silicon (Google TPU 2016, AWS Inferentia 2019, NVIDIA A100 2020)
Google published details of its Tensor Processing Unit (TPU v1) at ISCA 2017, revealing that the company had been running custom silicon in its data centers since 2015. The TPU was a hardware accelerator designed for matrix multiplication, the dominant compute primitive in deep learning inference. AWS followed with its Inferentia (2019) and Trainium (2021) chips; Microsoft with Project Brainwave FPGAs (2017) and Maia 100 (2023); Meta with its MTIA AI inference chip (2023). NVIDIA's A100 GPU (2020), built on TSMC's 7nm process with 54 billion transistors, became the reference chip for large-scale AI training. For hardware engineers, the custom AI accelerator era created a new employer class: hyperscalers and AI labs, which previously bought chips off the shelf, now needed internal teams of hundreds of chip architects, RTL engineers, and silicon validation engineers. Salaries at this tier reached $300,000-$600,000+ for principal architects.
Effect on the workThe custom silicon boom at hyperscalers was a major driver of the employment recovery from the 2014 trough. Hardware engineers who had previously worked only at traditional semiconductor companies (Intel, Qualcomm, Broadcom) found a new set of well-funded employers competing aggressively for the same scarce talent pool, pulling median wages upward and creating regional hiring hubs in Seattle, New York, and Austin alongside the traditional Silicon Valley concentration.
AI-native EDA and the CHIPS Act (Cadence Cerebrus, Synopsys DSO.ai, NVIDIA ChipNeMo)
Two parallel events in 2022 reshaped the demand and tool landscape for hardware engineers simultaneously. The CHIPS and Science Act (August 2022) committed $52.7 billion in federal semiconductor investment, triggering an estimated $400 billion in private fab construction and design hiring. And the commercial launch of AI-native EDA tools began in earnest: Cadence Cerebrus AI Studio used reinforcement learning to optimize chip implementation, achieving 5-10x delivery speedup and 20% power-performance-area improvements; Synopsys DSO.ai reported greater than 3x designer productivity; NVIDIA's ChipNeMo (2023) demonstrated domain-adapted LLMs generating production-quality EDA scripts and HDL. Siemens launched its Fuse EDA AI Agent in March 2026, orchestrating end-to-end RTL-to-GDSII workflows conversationally. For engineers, these tools do not replace the work but compress the implementation cycle and raise the design complexity a single engineer can manage, reshaping which skills command the highest premium: system architecture, tape-out accountability, and post-silicon bring-up remain irreducibly human; EDA scripting and routine implementation are increasingly AI-augmented.
Effect on the workHardware engineering employment recovered from 60,750 (2018) to 75,710 (2024), a 25% increase, as the AI chip boom and the CHIPS Act lifted demand. BLS projects 7% further growth through 2034, faster than the all-occupations average of 4%. The SIA projects a gap of 67,000 unfilled semiconductor workers by 2030, with hardware engineering roles among the most cited shortages.
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Browse all rolesComputer Hardware Engineers employment and pay by year
View all 24 years of cited US data, each linked to its source
| Year | US employment | Annual pay (median unless marked) | Source | Report |
|---|---|---|---|---|
| 1999 | 60,420 | $64,730 | BLS OEWS 1999 Official statistic | Report |
| 2003 | 72,550 | $75,980 | BLS OEWS May 2003 Official statistic | Report |
| 2004 | 74,760 | $81,150 | BLS OEWS May 2004 Official statistic | Report |
| 2005 | 78,580 | $84,420 | BLS OEWS May 2005 Official statistic | Report |
| 2006 | 74,480 | $88,470 | BLS OEWS May 2006 Official statistic | Report |
| 2007 | 79,330 | $91,860 | BLS OEWS May 2007 Official statistic | Report |
| 2008 | 73,370 | $97,400 | BLS OEWS May 2008 Official statistic | Report |
| 2009 | 65,410 | $98,820 | BLS OEWS May 2009 Official statistic | Report |
| 2010 | 66,960 | $98,810 | BLS OEWS May 2010 Official statistic | Report |
| 2011 | 71,990 | $98,610 | BLS OEWS May 2011 Official statistic | Report |
| 2012 | 79,580 | $100,920 | BLS OEWS May 2012 Official statistic | Report |
| 2013 | 77,670 | $104,250 | BLS OEWS May 2013 Official statistic | Report |
| 2014 | 76,360 | $108,430 | BLS OEWS May 2014 Official statistic | Report |
| 2015 | 75,870 | $111,730 | BLS OEWS May 2015 Official statistic | Report |
| 2016 | 72,950 | $115,080 | BLS OEWS May 2016 Official statistic | Report |
| 2017 | 66,770 | $115,120 | BLS OEWS May 2017 Official statistic | Report |
| 2018 | 60,750 | $114,600 | BLS OEWS May 2018 Official statistic | Report |
| 2019 | 67,880 | $117,220 | BLS OEWS May 2019 Official statistic | Report |
| 2020 | 64,710 | $119,560 | BLS OEWS May 2020 Official statistic | Report |
| 2021 | 73,750 | $128,170 | BLS OEWS May 2021 Official statistic | Report |
| 2022 | 74,640 | $132,360 | BLS OEWS May 2022 Official statistic | Report |
| 2023 | 82,660 | $138,080 | BLS OEWS May 2023 Official statistic | Report |
| 2024 | 75,710 | $155,020 | BLS OEWS May 2024 (employment) Official statisticBLS OEWS May 2024 (pay) Official statistic | Report |
| 2025 | 76,660 | $161,740 | BLS OEWS May 2025 Official statistic | Report |
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